Mô tả công việc
– Responsible for the accuracy of goods warehousing, warehousing, and storage, continuously reduce the error rate; Responsible for the timely delivery of goods, continuously reduce the delivery time.- Responsible for the property, fire, and personnel safety of the warehouse department.- Responsible for the dispatch, use, distribution, and monitoring of transportation tools in warehouse department, improve the use efficiency and reduce costs.- Formulate inventory management measures, manage, and store goods, responsible for continuous optimization of the system to ensure goods “first in, first out”.- Organize quarterly inventory, handle inventory surplus, inventory loss, scrap and other approval procedures, inventory error rate is less than 1‰, hold monthly analysis meeting every month, analyze the accuracy and timeliness of each group and each position, Reporting error rates and performance of groups and positions.- Responsible for the shipment and packaging of finished products, and the finished goods and parts must be free from damage, leakage and missing;- Optimize the packaging process to improve the efficiency of packaging from damage, leakage and missing; Optimize the packaging process to improve the efficiency of packaging.
Phúc lợi
– Guaranteed 13th month salary, KPI bonus
– Health insurance for staff and dependent (spouse/ children)
– Birthday gift, married congratulation, childbirth congratulation…
– 14 AL days/ year + 6 paid sick leave days, 1 extra al after 1 completed year
Kinh nghiệm / Kỹ năng chi tiết
– College or bachelor graduation- At least 1 year experience in relevant job with system mindset- English skill is required.- Good at MS office
Thông tin liên hệ
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Tên liên hệ:
Ms. Quyên
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Lot I-15-1, Street D12, Tang Nhon Phu B, Saigon Hi-Tech Park
,
Thành Phố Thủ Đức
,
Hồ Chí Minh
,
Viet Nam
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Nhận hồ sơ bằng ngôn ngữ:
Tiếng Anh
Về công ty
BESI VIET NAM
100 – 499 nhân viên
Liên hệ: Ms. Quyên
BE Semiconductor Industries N.V. (Besi) develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud server, computing, automotive, industrial, LED and solar energy.