Mô tả công việc
– Enhance the processes and guideline for purchasing related matters
– To coordinate the validation of development part, liaise with related departments and vendors until the part is being validated / qualified.
– To ensure the correct methods and procedures are applied by the supplier during the development and ensure the supplier is fully understand the Besi requirements.
– To conduct supplier audit and visit to ensure vendor is fully equip to supply items and suppliers facilities is always in full conditions.
– To initiate contracts with key vendors for critical materials
– Provide the necessary technical supports for internal departments and vendors
– Continuously seek improvement in the works areas and strengthen the supply chain for business processes
– Propose alternative suppliers and processes to minimize the business risk and cost improvement opportunity for Material Management.
– To establish the cost structure for the vendors part and best price negotiation with the vendor.
– Others as assigned.
Phúc lợi
14 annual days per year and 6 paid sickleave days, 1 extra day after each 1 completed year
health insurance for staffs and spouse, children
Tet gift, birthday gift…
13th month salary, KPI bonus
Kinh nghiệm / Kỹ năng chi tiết
– Strong knowledge on machining processes (material removal process)
– Strong knowledge on various type of casting and machining.
– Good knowledge in system automation equipment concept.
– Understanding of Geomatric Tolerance GD&T related
– Understanding of ERP system relates to Material Management Modules
– MS Office with intermediate knowhow and skills
Thông tin liên hệ
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Tên liên hệ:
Ms. Quyên
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Lot I-15-1, Street D12, Tang Nhon Phu B, Saigon Hi-Tech Park
,
Thành Phố Thủ Đức
,
Hồ Chí Minh
,
Viet Nam
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– Please send your application by online
Nhận hồ sơ bằng ngôn ngữ:
Tiếng Anh
(Chỉ nhận hồ sơ Tiếng Anh)
Về công ty
BESI VIET NAM
100 – 499 nhân viên
Liên hệ: Ms. Quyên
BE Semiconductor Industries N.V. (Besi) develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud server, computing, automotive, industrial, LED and solar energy.